Litcius/Paper detail

AI classification of wafer map defect patterns by using dual-channel convolutional neural network

Shouhong Chen, Yuxuan Zhang, Mulan Yi, Yuling Shang, Ping Yang

2021Engineering Failure Analysis40 citationsDOI

Topics & Concepts

WaferPattern recognition (psychology)Convolutional neural networkArtificial intelligenceComputer scienceArtificial neural networkConvolution (computer science)Feature extractionChannel (broadcasting)Support vector machineFeature (linguistics)Electronic engineeringEngineeringMaterials scienceOptoelectronicsPhilosophyLinguisticsComputer networkIndustrial Vision Systems and Defect DetectionIntegrated Circuits and Semiconductor Failure AnalysisAdvancements in Photolithography Techniques