Molecular engineering of dynamically bonded degradable epoxy resins for enhanced dielectric, mechanical, and thermal performance
Xi Chen, Jinyue Dai, Kerong Yang, Shuaipeng Wang, Dandan Jin, Jingkai Liu, Xiaoqing Liu
Topics & Concepts
EpoxyMaterials scienceThermosetting polymerComposite materialFlexural strengthDielectric strengthDielectricComposite numberFiller (materials)FabricationMaterial DesignThermal stabilitySpace chargePolymerBond strengthDynamic loadingBoron nitrideBand gapThermal conductivityPower densityElectrical resistivity and conductivityElectrical breakdownDensity functional theorySynthesis and properties of polymersSilicone and Siloxane ChemistryEpoxy Resin Curing Processes