Litcius/Paper detail

A Novel Microstructure of Cu-Ti Alloy with Ultrahigh Electrical Conductivity and Strength

Yabo Fu, Jian Qi, Xin Wang, Jinchuan Jie, Renqing Guo

2024Journal of Materials Engineering and Performance17 citationsDOI

Topics & Concepts

Materials scienceMicrostructureAlloyElectrical resistivity and conductivityMetallurgyTitanium alloyConductivityComposite materialElectrical engineeringPhysical chemistryEngineeringChemistryMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties