Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances
Shuai Zhang, Shuai Zhang, Qingyang Qiu, Tianran Ding, Weimin Long, Sujuan Zhong, Kyung‐Wook Paik, Peng He, Shuye Zhang, Shuye Zhang
Topics & Concepts
Materials scienceIsothermal processSolderingSubstrate (aquarium)MetallurgyThermodynamicsPhysicsOceanographyGeologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis