High-temperature soybean meal adhesive based on disulfide bond rearrangement and multiple crosslinking: Water resistance and prepressing adhesion
Qian Yan, Chao Ma, Zhenxuan Liang, Shifeng Zhang
Topics & Concepts
AdhesiveEpichlorohydrinMaterials scienceDisulfide bondPolyamideComposite materialAdhesionChemistryLayer (electronics)BiochemistryLignin and Wood Chemistrybiodegradable polymer synthesis and propertiesPolymer Surface Interaction Studies