Growth kinetics of intermetallic compounds in Cu–Ti diffusion couples
Chao Liu, Zhiyi Song, Yonggang Fan, В. Е. Рогалин, Cong Wang
Topics & Concepts
IntermetallicMaterials scienceDiffusionKineticsAtom (system on chip)Electron microprobeActivation energyMetallurgyCrystallographyThermodynamicsPhysical chemistryChemistryAlloyQuantum mechanicsEmbedded systemComputer sciencePhysicsIntermetallics and Advanced Alloy PropertiesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties