Litcius/Paper detail

Dynamic thermal performance and energy-saving potential analysis of a modular pipe-embedded building envelope integrated with thermal diffusive materials

Yang Yang, Sarula Chen

2023Building Simulation15 citationsDOI

Topics & Concepts

Materials scienceThermal conductivityBuilding envelopeCavity wallHeat transferOpacityThermalComposite materialThermal resistanceThermal conductionThermal transmittanceModular designThermal bridgeThermal insulationMechanical engineeringStructural engineeringLayer (electronics)MechanicsEngineeringOpticsComputer scienceThermodynamicsPhysicsOperating systemBuilding Energy and Comfort OptimizationUrban Heat Island MitigationWind and Air Flow Studies
Dynamic thermal performance and energy-saving potential analysis of a modular pipe-embedded building envelope integrated with thermal diffusive materials | Litcius