A comprehensive numerical analysis for preventing cracks in 2.5D glass interposer

Xuan-Bach D. Le, Sung‐Hoon Choa

2024Journal of Mechanical Science and Technology14 citationsDOI

Topics & Concepts

InterposerMaterials scienceStructural engineeringForensic engineeringMechanical engineeringEngineering physicsComputer scienceEngineeringComposite materialLayer (electronics)Etching (microfabrication)3D IC and TSV technologiesAdvanced Surface Polishing TechniquesNanofabrication and Lithography Techniques