Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging
Yuanyuan Qiao, Ning Zhao
Topics & Concepts
Reliability (semiconductor)Materials scienceSolderingAnisotropyReliability engineeringComposite materialElectronic packagingOrientation (vector space)MetallurgyMechanical engineeringEngineering physicsEngineeringOpticsGeometryPhysicsQuantum mechanicsMathematicsPower (physics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloy Microstructure Properties