Process mechanism of ultrafast laser multi-focal-scribing for ultrafine and efficient stealth dicing of SiC wafers
Lingfeng Wang, Chen Zhang, Feng Liu, Huai Zheng, Gary J. Cheng
Topics & Concepts
Wafer dicingMaterials scienceWaferLaserSilicon carbideMachiningLaser ablationOptoelectronicsSurface roughnessLaser beam machiningSurface finishOpticsLaser cuttingComposite materialMetallurgyPhysicsLaser beamsLaser Material Processing TechniquesAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials Research