Architecture of Cobweb-Based Redundant TSV for Clustered Faults
Tianming Ni, Dongsheng Liu, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan
Abstract
In this brief, a cobweb-based redundant through-silicon-via (TSV) design is proposed with efficient hardware as well as high repair rate to repair clustered faulty TSVs (FTSVs). The experimental simulation results demonstrate that for highly clustered faults, the repair rate of the proposed RTSV method is 48.59% and 1.75% higher than that of the ring-based and router-based RTSV methods, respectively. Furthermore, the proposed design can achieve 63.93% and 16.34% hardware reductions compared with the router-based and the ring-based design, respectively.
Topics & Concepts
RouterComputer scienceEmbedded systemFailure rateRing (chemistry)ArchitectureParallel computingReliability engineeringEngineeringComputer networkChemistryGeographyArchaeologyOrganic chemistry3D IC and TSV technologiesInterconnection Networks and SystemsAdvanced Memory and Neural Computing