Diffusion bonding of copper to titanium using CoCrFeMnNi high-entropy alloy interlayer
Wen Ding, Ning Liu, Jiacheng Fan, Jing Cao, Xiaojing Wang
Topics & Concepts
Materials scienceAlloyIntermetallicCopperDiffusionDiffusion barrierTitaniumSolid solutionTitanium alloyMetallurgyActivation energyComposite materialThermodynamicsLayer (electronics)Physical chemistryChemistryPhysicsHigh Entropy Alloys StudiesHigh-Temperature Coating BehaviorsIntermetallics and Advanced Alloy Properties