Multi-scale Approach to Predict Cure-Induced Residual Stresses in an Epoxy System
Sagar Patil, Sagar Shah, Prathamesh Deshpande, Khatereh Kashmari, Michael N. Olaya, Gregory M. Odegard, Marianna Maiarù
Abstract
This article details the modeling of the EPON862/DETDA epoxy system using Molecular Dynamics to predict the mechanical properties as a function of crosslinking density. The Reactive Interface Force Field (IFF-R) is implemented in this work. The properties of the epoxy system were predicted at different crosslinking levels. The predicted density, shrinkage, and bulk modulus showed a good agreement with other modeling and experimental data in literature.
Topics & Concepts
EpoxyMaterials scienceModulusResidual stressShrinkageComposite materialInterface (matter)ResidualWork (physics)Scale (ratio)Young's modulusMolecular dynamicsComputer scienceMechanical engineeringComputational chemistryPhysicsAlgorithmEngineeringChemistryCapillary numberQuantum mechanicsCapillary actionEpoxy Resin Curing ProcessesMechanical Behavior of CompositesFiber-reinforced polymer composites