Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination
Abhishek Kwatra, David Samet, V. N. N. Trilochan Rambhatla, Suresh K. Sitaraman
Topics & Concepts
Materials scienceMicroelectronicsDelamination (geology)Composite materialMolding (decorative)EpoxyCopperHumidityThermal expansionMetallurgyOptoelectronicsPaleontologyTectonicsSubductionBiologyPhysicsThermodynamicsElectronic Packaging and Soldering TechnologiesMechanical Behavior of Composites3D IC and TSV technologies