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Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Hong-Sub Joo, Choong-Jae Lee, Kyung Deuk Min, Byeong-Uk Hwang, Seung‐Boo Jung

2020Journal of Materials Science Materials in Electronics29 citationsDOI

Topics & Concepts

SolderingIntermetallicMaterials scienceMicrostructureInterconnectionScanning electron microscopeComposite materialSolder pasteMetallurgyFlip chipLayer (electronics)Computer networkAdhesiveAlloyComputer scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdditive Manufacturing Materials and Processes
Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding | Litcius