Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves
Ding Yuan, Wei Zhou, Ting Fu, Qingyu Dong
Abstract
Abstract To improve the heat transfer performance of microchannels, a novel microchannel embedded with connected grooves crossing two sidewalls and the bottom surface (type A) was designed. A comparative study of heat transfer was conducted regarding the performances of type A microchannels, microchannels embedded with grooves on their bottom (including types B and C), or on the sidewalls (type D) as well as smooth rectangular microchannels (type E) via a three-dimensional numerical simulation and experimental validation (at Reynolds numbers from 118 to 430). Numerical results suggested that the average Nusselt number of types A, B, C, and D microchannels were 106, 73.4, 50.1, and 12.6% higher than that of type E microchannel, respectively. The smallest synergy angle β and entropy generation number N s,a were determined for type A microchannels based on field synergy and nondimensional entropy analysis, which indicated that type A exhibited the best heat transfer performance. Numerical flow analysis indicated that connected grooves induced fluid to flow along two different temperature gradients, which contributed to enhanced heat transfer performance.