Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint
Zhihang Zhang, Jiawei Qu, Tao Ma, Yue Zhao, Zhongshan Zhou, Jihua Huang, Shuhai Chen, Zheng Ye, Jian Yang
Topics & Concepts
Materials scienceIntermetallicSolderingMetallurgyJoint (building)Mechanism (biology)CoatingComposite materialStructural engineeringAlloyEngineeringPhilosophyEpistemologyElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites Properties