Recovery of copper from electroplating sludge using integrated bipolar membrane electrodialysis and electrodeposition
Yaoxing Liu, Mingzhi Lv, Xiaoyun Wu, Jianguo Ding, Liping Dai, Hun Xue, Xin Ye, Riyao Chen, Rui Ding, Jianxi Liu, Bart Van der Bruggen
Topics & Concepts
ElectroplatingCopperElectrodialysisPlating (geology)Copper platingChemistryCurrent densityFOIL methodReagentMembrane technologyMembraneMaterials scienceMetallurgyChemical engineeringNanotechnologyComposite materialLayer (electronics)GeophysicsQuantum mechanicsPhysical chemistryBiochemistryGeologyEngineeringPhysicsMembrane-based Ion Separation TechniquesElectrodeposition and Electroless CoatingsSupercapacitor Materials and Fabrication