Litcius/Paper detail

Origami-Inspired Conductive Paper-Based Folded Pressure Sensor with Interconnection Scaling at the Crease for Novel Wearable Applications

Rajat Subhra Karmakar, Jhih‐Fong Huang, Chia-Pei Chu, M. Mai, Jui‐I Chao, Ying‐Chih Liao, Yen‐Wen Lu

2023ACS Applied Materials & Interfaces17 citationsDOI

Abstract

Drawing inspiration from origami structures, a pressure sensor was developed with unique interconnection scaling at its creases crafted on a conductive paper substrate, paving the way for advanced wearable technology. Two screen-printed conductive paper substrates were combined face-to-face, and specific folds were introduced to optimize the sensor structure. The Electrical Contact Resistance (ECR) was systematically analyzed across different fold numbers and crease gaps, revealing a notable trade-off: while increasing the number of folds expanded the sensing area, it also influenced the ECR, reaching a performance plateau. Strategic modifications in the sensor’s design, including refining interconnections at the crease, enhanced its sensitivity and stability, culminating in a remarkable sensitivity of 3.75 kPa –1 at subtle pressure levels (0–0.05 kPa). This sensor’s real-world applications proved to be transformative, from detecting bruxism and aiding in neck posture correction to remotely sensing trigger finger locking phenomena, highlighting its potential as a pivotal tool in upcoming medical diagnostics and treatments.

Topics & Concepts

InterconnectionMaterials scienceWearable computerElectrical conductorPressure sensorNanotechnologyWearable technologySensitivity (control systems)ScalingComputer scienceOptoelectronicsElectronic engineeringMechanical engineeringEmbedded systemTelecommunicationsComposite materialEngineeringGeometryMathematicsAdvanced Sensor and Energy Harvesting MaterialsTactile and Sensory InteractionsInteractive and Immersive Displays