Co-optimization of electrical-thermal–mechanical behaviors of an on-chip thermoelectric cooling system using response surface method
Tingrui Gong, Gu Hou, Yongjia Wu, Lianghui Li, Yuexing Wang, Maolin Shi, Lingfeng Kang, Jie Zhou, Linwei Cao, Lei Gao, Tingzhen Ming, Juntao Li, Wei Su
Topics & Concepts
Materials scienceThermoelectric effectThermalChipThermoelectric coolingMechanical engineeringComposite materialEngineeringElectrical engineeringThermodynamicsPhysicsAdvanced Thermoelectric Materials and DevicesThermal properties of materialsThermal Radiation and Cooling Technologies