Molecular dynamics simulation of the direct bonding of (111)-oriented nanotwinned Cu and its related mechanical behavior
Cheng-Da Wu, Chien-Fu Liao
Topics & Concepts
Materials scienceYield (engineering)Anodic bondingDirect bondingThermocompression bondingMolecular dynamicsComposite materialDuctility (Earth science)DiffusionUltimate tensile strengthMetallurgyChemistrySiliconLayer (electronics)ThermodynamicsComputational chemistryCreepPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability