The bonding characteristics of the Cu(111)/WC(0001) interface: An insight from first-principle calculations
Zhangxi Wu, Mingjun Pang, Yongzhong Zhan, Shi Shu, Xiong Lu, Zihao Li
Topics & Concepts
Covalent bondMaterials scienceInterface (matter)Stack (abstract data type)Surface energyAdhesionWork (physics)Chemical bondElectronic structureBond energyCrystallographyComposite materialMoleculeChemistryComputational chemistryThermodynamicsPhysicsComputer scienceOrganic chemistryProgramming languageCapillary actionCapillary numberAdvanced materials and compositesCopper Interconnects and ReliabilityMetal and Thin Film Mechanics