A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs
Xinzhi Wu, Zhijia Han, Yongbin Zhu, Biao Deng, Kang Zhu, Chengyan Liu, Feng Jiang, Weishu Liu
Topics & Concepts
Materials scienceShear strength (soil)Thermoelectric effectThermoelectric materialsSolderingComposite materialTernary operationContact resistanceDiffusion barrierDopantThermal conductivityThermal stabilityElectrical contactsElectrical resistivity and conductivityPassivationThermal diffusivityLayer (electronics)OptoelectronicsDopingThermodynamicsElectrical engineeringChemical engineeringSoil scienceProgramming languageEnvironmental scienceEngineeringPhysicsSoil waterComputer scienceAdvanced Thermoelectric Materials and DevicesThermal Expansion and Ionic ConductivityThermal properties of materials