Litcius/Paper detail

Study on particle removal during the Co post-CMP cleaning process

Yuanshen Cheng, Shengli Wang, Hongliang Li, Chenwei Wang, Yundian Yang, Shuangshuang Lei, Sen Li

2021Colloids and Surfaces A Physicochemical and Engineering Aspects25 citationsDOI

Topics & Concepts

WettingZeta potentialX-ray photoelectron spectroscopyChemical-mechanical planarizationContact angleMaterials scienceChemical engineeringScanning electron microscopeParticle (ecology)NanotechnologyChemistryPolishingComposite materialNanoparticleEngineeringOceanographyGeologyAdvanced Surface Polishing TechniquesMinerals Flotation and Separation TechniquesPolymer Surface Interaction Studies
Study on particle removal during the Co post-CMP cleaning process | Litcius