An investigation of monitoring the damage mechanism in ultra-precision grinding of monocrystalline silicon based on AE signals processing
Sheng Wang, Qingliang Zhao, Tao Wu
Topics & Concepts
Monocrystalline siliconMaterials scienceGrindingAcoustic emissionBrittlenessAccuracy and precisionSIGNAL (programming language)Signal processingAcousticsSiliconOptoelectronicsComputer scienceElectronic engineeringComposite materialDigital signal processingEngineeringProgramming languagePhysicsStatisticsMathematicsAdvanced machining processes and optimizationAdvanced Surface Polishing TechniquesLaser Material Processing Techniques