Systematic study of the effect of silane coupling agent on the hydrothermal aging resistance of the underfill epoxy resin and silica interface via molecular dynamics simulation
wei Wang, Xuecheng Yu, Cheng Lai, Gang Li, Pengli Zhu, Rong Sun
Topics & Concepts
EpoxyHydrothermal circulationMaterials scienceComposite materialSilaneMolecular dynamicsFlip chipCoupling (piping)Chemical engineeringChemistryLayer (electronics)Computational chemistryAdhesiveEngineeringHigh voltage insulation and dielectric phenomenaCorrosion Behavior and InhibitionEpoxy Resin Curing Processes