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Realization of multidimensional sound propagation in 3D acoustic higher-order topological insulator

Fei Meng, Yafeng Chen, Weibai Li, Baohua Jia, Xiaodong Huang

2020Applied Physics Letters22 citationsDOIOpen Access PDF

Abstract

Higher-order topological insulators (TIs) develop the conventional bulk-boundary correspondence theory and increase the interest in searching innovative topological materials. To realize a higher-order TI with a wide passband of one-dimensional (1D) and two-dimensional (2D) transportation modes, we design three-dimensional non-trivial and trivial sonic crystals whose combination mimics the Su–Schrieffer–Heeger model. The topological boundary states can be found at the interfaces, including the zero-dimensional corner state, 1D hinge state, and 2D surface state. The fabricated sample with the bent two-dimensional and one-dimensional acoustic channels exhibits the multidimensional sound propagation and verifies the mode transition among the complete bandgap, hinge mode, and surface mode. The bandwidth of the single-mode hinge state achieves a large relative bandwidth of 9.1% in which sound transports one-dimensionally without significant leak into the surfaces or the bulk. The higher-order topological states in the study pave the way for sound manipulation in multiple dimensions.

Topics & Concepts

HingeTopological insulatorTopology (electrical circuits)Bandwidth (computing)PhysicsRealization (probability)AcousticsBoundary value problemBoundary (topology)Bent molecular geometrySound propagationAcoustic metamaterialsPassbandInsulator (electricity)Surface (topology)Acoustic waveSurface acoustic waveComputer scienceTopological Materials and PhenomenaThermal properties of materialsCarbon Nanotubes in Composites
Realization of multidimensional sound propagation in 3D acoustic higher-order topological insulator | Litcius