Insight into the influence of Cu6Sn5/Cu micro-interface configuration on growth behavior of Cu-Sn interfacial intermetallic compounds in Sn/Cu solder joint
Tao Ma, Xin Sun, Zhihang Zhang, Shiqiang Zhang, Rui Pan, Jian Yang
Topics & Concepts
IntermetallicMaterials scienceSolderingAtom (system on chip)DiffusionCrystallographyCopperPopulationMetallurgyThermodynamicsAlloyChemistrySociologyComputer sciencePhysicsDemographyEmbedded systemElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties