Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder
H. Elhosiny Ali, A. M. El-Taher, H. Algarni
Topics & Concepts
Materials scienceMicrostructureEutectic systemSolderingUltimate tensile strengthBismuthMetallurgyDifferential scanning calorimetryDuctility (Earth science)PrecipitationAlloyElectrical resistivity and conductivityComposite materialCreepThermodynamicsElectrical engineeringMeteorologyPhysicsEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis