Intermetallic formation mechanisms and properties in room-temperature Ga soldering
Shiqian Liu, Dong Qu, Stuart D. McDonald, Qinfen Gu, Syo Matsumura, Kazuhiro Nogita
Topics & Concepts
IntermetallicEutectic systemMaterials scienceThermal expansionWettingAlloySolderingMicrostructureMetallurgyMicroelectronicsSynchrotronGalliumComposite materialNanotechnologyPhysicsNuclear physicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties