Litcius/Paper detail

Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state

Yahong Du, Li‐Yin Gao, Daquan Yu, Zhi‐Quan Liu

2020Journal of Materials Science Materials in Electronics18 citationsDOI

Topics & Concepts

ElectromigrationWire bondingMaterials scienceIntermetallicComposite materialDiffusion bondingMolding (decorative)Fracture (geology)DiffusionMetallurgyElectrical engineeringPhysicsEngineeringAlloyChipThermodynamicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability
Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state | Litcius