Performance of Bi2Te3-based thermoelectric modules tailored by diffusion barriers
Yen Ngoc Nguyen, Kyung Tae Kim, Soo‐Ho Chung, Injoon Son
Topics & Concepts
SolderingMaterials scienceIntermetallicCoatingDiffusion barrierMetallurgyWettingLayer (electronics)Thermoelectric effectElectrodeComposite materialAlloyChemistryPhysicsPhysical chemistryThermodynamicsAdvanced Thermoelectric Materials and DevicesElectronic Packaging and Soldering TechnologiesThermal properties of materials