Litcius/Paper detail

Performance of Bi2Te3-based thermoelectric modules tailored by diffusion barriers

Yen Ngoc Nguyen, Kyung Tae Kim, Soo‐Ho Chung, Injoon Son

2021Journal of Alloys and Compounds19 citationsDOI

Topics & Concepts

SolderingMaterials scienceIntermetallicCoatingDiffusion barrierMetallurgyWettingLayer (electronics)Thermoelectric effectElectrodeComposite materialAlloyChemistryPhysicsPhysical chemistryThermodynamicsAdvanced Thermoelectric Materials and DevicesElectronic Packaging and Soldering TechnologiesThermal properties of materials
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