The Effect of Electric-Thermal-Vibration Stress Coupling on the Reliability of Sn-Ag-Cu Solder Joints
Xinlan Hu, Liang He, Hua Chen, Yunxuan Lv, Haowen Gao, Juncheng Liu
Topics & Concepts
Ball grid arrayMaterials scienceSolderingRandom vibrationCoupling (piping)VibrationStructural engineeringFinite element methodReliability (semiconductor)Stress (linguistics)Superposition principleComposite materialEngineeringPhysicsThermodynamicsAcousticsLinguisticsPhilosophyPower (physics)Quantum mechanicsElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisFatigue and fracture mechanics