Design and solderability characterization of novel Au–30Ga solder for high-temperature packaging

Han Liu, Songbai Xue, Yu Tao, Weimin Long, Sujuan Zhong

2020Journal of Materials Science Materials in Electronics20 citationsDOI

Topics & Concepts

SolderabilitySolderingMaterials scienceEutectic systemIntermetallicShear strength (soil)MicrostructureMetallurgyMelting pointAlloyJoint (building)WettingComposite materialSoil waterEngineeringEnvironmental scienceArchitectural engineeringSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesSemiconductor materials and interfaces