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Sintering of Cu nanoparticles for optimized particle size and enhanced interconnect performance

Ping-Hsuan Chen, Hung Wang, Kelvin Li, Chang-Meng Wang, Cheng‐Yi Liu, Albert T. Wu

2025Journal of the Taiwan Institute of Chemical Engineers9 citationsDOI

Topics & Concepts

SinteringMaterials scienceNanoparticleInterconnectionParticle sizeParticle (ecology)Chemical engineeringNanotechnologyMetallurgyComputer scienceTelecommunicationsGeologyOceanographyEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability
Sintering of Cu nanoparticles for optimized particle size and enhanced interconnect performance | Litcius