Advancements in 3D printing and hot isostatic pressing of copper: bridging the gap between green and sintered states for enhanced mechanical and electrical properties
Kameswara Pavan Kumar Ajjarapu, Carrie Barber, James P. Taylor, Thomas W. Pelletiers, Douglas Jackson, Chad Beamer, Sundar V. Atre, Kunal H. Kate
Topics & Concepts
Bridging (networking)Materials scienceHot isostatic pressingCopperPressingMetallurgy3D printingComposite materialSinteringComputer scienceComputer networkAdditive Manufacturing and 3D Printing TechnologiesElectronic Packaging and Soldering TechnologiesInjection Molding Process and Properties