Incorporating paraffin@SiO<sub>2</sub> nanocapsules with abundant surface hydroxyl groups into polydimethylsiloxane to develop composites with enhanced interfacial heat conductance for chip heat dissipation
Shushan Li, Zekai Lin, Zezhi Zhou, Yuliang Zhao, Ziye Ling, Zhengguo Zhang, Xiaoming Fang
Abstract
nanocapsules at a loading of 36 wt% into the polymer matrix made a remarkable decrease in the chip equilibrium temperature by 31.7 °C, and a further decline by 8.9 °C occurred when combined with 16 wt% BN. This work sheds light on facilitating the interfacial heat conductance between phase change capsules and the polymer matrix by hydrogen bonding.
Topics & Concepts
NanocapsulesMaterials scienceComposite materialThermal conductivityComposite numberPolymerPolydimethylsiloxaneSilsesquioxaneChemical engineeringNanotechnologyNanoparticleEngineeringPhase Change Materials ResearchAdvanced Battery Materials and TechnologiesThermal properties of materials