Low-temperature Cu-to-Cu electrode bonding by sintering Cu core-Ag shell nanoparticle paste
Seok-Hwan Chung, Jong Tae Kim, Sang Won Jeong
Topics & Concepts
Materials scienceSinteringComposite materialShear strength (soil)NanoparticleThermal conductivityMetalMetallurgyNanotechnologySoil scienceSoil waterEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies