In-situ study of creep in Sn-3Ag-0.5Cu solder
Tianhong Gu, Vivian Tong, C.M. Gourlay, T. Ben Britton
Topics & Concepts
Materials scienceElectron backscatter diffractionCreepMicrostructureIntermetallicGrain boundaryLüders bandSlip (aerodynamics)MetallurgyIn situComposite materialAlloyThermodynamicsMeteorologyPhysicsElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloy Microstructure Properties