Towards understanding the coupling interaction between thickness non-uniformity and flatness of wafer-scale electroformed Ni-Co mold: From grain structures to internal stress
Honggang Zhang, Bingqi Ma, Tianyu Zhan, Haibin Liu
Topics & Concepts
ElectroformingFlatness (cosmology)MoldMaterials scienceInternal stressWaferCoupling (piping)MetallurgyComposite materialStress (linguistics)Mechanical engineeringOptoelectronicsEngineeringLayer (electronics)PhilosophyLinguisticsQuantum mechanicsCosmologyPhysicsElectronic Packaging and Soldering TechnologiesElectrodeposition and Electroless CoatingsMetallic Glasses and Amorphous Alloys