Litcius/Paper detail

Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems

Jiwan Kang, Ashutosh Sharma, Jae Pil Jung

2025Journal of Materials Science Materials in Electronics8 citationsDOI

Topics & Concepts

Materials scienceSolderingNanoparticleMicrosystemMetallurgyNanotechnologyThermalComposite materialMeteorologyPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties
Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems | Litcius