Litcius/Paper detail

Microstructures and properties evolution of Al-Zn-Mg-Cu alloy under electrical pulse assisted creep aging

Tian-Jun Bian, Heng Li, Chao Lei, Changhui WU, Liwen Zhang

2022Advances in Manufacturing16 citationsDOI

Topics & Concepts

Materials scienceMicrostructureAlloyCreepGrain boundaryCorrosionMetallurgyIntergranular corrosionElectromagnetic Effects on MaterialsAluminum Alloy Microstructure PropertiesMicrostructure and mechanical properties