Efficient transient thermal analysis of chiplet heterogeneous integration
Chuanjun Nie, Qinzhi Xu, Chenghan Wang, He Cao, Jianyun Liu, Zhiqiang Li
Topics & Concepts
Thermal conductionSolverTransient (computer programming)Thermal conductivityThermalMaterials scienceFinite difference methodBoundary value problemElectronic engineeringFinite element methodMechanical engineeringComputer scienceComputational scienceEngineeringMathematicsThermodynamicsStructural engineeringPhysicsProgramming languageMathematical analysisComposite materialOperating system3D IC and TSV technologiesSilicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering Technologies