Study on material removal mechanism of sapphire wafer with CeO2 coated diamond composite abrasives via green polishing
Yongchao Xu, Guangen Zhao, Qianting Wang, Youji Zhan, Bingsan Chen
Topics & Concepts
PolishingMaterials scienceAbrasiveDiamondWaferComposite numberSapphireChemical-mechanical planarizationSurface roughnessComposite materialSlurryMetallurgyNanotechnologyOpticsLaserPhysicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization