Study on subsurface damage behavior in ductile ultra-precision grinding of sapphire based on acoustic emission signal processing
Sheng Wang, Sheng Wang, Sheng Wang, Sheng Wang, Shu Wang, Shu Wang, Qingliang Zhao
Topics & Concepts
Materials scienceGrindingSIGNAL (programming language)SpallPolishingAcoustic emissionComposite materialBrittlenessGrinding wheelSapphireOpticsLaserProgramming languageComputer sciencePhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques