Light Weight Organic Composites with High Thermal Management Capability
Yingying Guo, Kang Xu, Yandong Wang, Zhenbang Zhang, Ping Gong, Jianxiang Zhang, Linhong Li, Rongjie Yang, Yue Qin, Xingye Wang, Boda Zhu, Tao Cai, Cheng‐Te Lin, Kazuhito Nishimura, Maohua Li, Nan Jiang, Jinhong Yu
Abstract
With the advancement of science and technology, effectively addressing the issue of heat dissipation in electronic equipment has become a key research topic. Polymers have attracted attention due to their low price, excellent flexibility, and lightweight characteristics, but thermal conductivity has a limitation. In this work, aiming for all-polymer composites with lightweight and high thermal conductivity, poly(p-phenylene benzobisoxazole) (PBO) fibers were used to construct a long-range ordered heat transfer path in the organosilicon matrix, and an all-organic composite material with a low density of 1.24 g cm –3 and thermal conductivity of 18.44 W/ (m K) was produced. At the same time, the composite material was applied to the cooling performance test of LED lamps, which was 4.8 °C lower than advanced commercial thermal conductive materials, demonstrating its potential in the field of thermal management materials.