An investigation on diffusion bonding of Cu/Cu using various grain size of Ni interlayers at low temperature
Tong Lin, Chun Li, Xiaoqing Si, Xinru Li, Bo Yang, Jicai Feng, Jian Cao
Topics & Concepts
Materials scienceDiffusion bondingCopperRecrystallization (geology)DiffusionGrain boundary diffusion coefficientGrain sizeSurface diffusionGrain growthMetallurgyDiffusion barrierAtomic diffusionThermocompression bondingComposite materialCrystallographyLayer (electronics)Grain boundaryMicrostructureThermodynamicsPhysical chemistryPhysicsBiologyPaleontologyChemistryAdsorptionMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesSurface Treatment and Residual Stress