Litcius/Paper detail

Enhanced mechanical properties and high electrical conductivity of copper alloy via dual-nanoprecipitation

Meng Zhou, Yongfeng Geng, Yi Zhang, Yijie Ban, Xu Li, Yanlin Jia, Shengli Liang, Baohong Tian, Yong Liu, Alex A. Volinsky

2022Materials Characterization29 citationsDOI

Topics & Concepts

Materials scienceCopperAlloyElectrical resistivity and conductivityPrecipitation hardeningVolume fractionMetallurgyGrain boundaryPrecipitationWork hardeningTexture (cosmology)ConductivityComposite materialMicrostructureChemistryPhysicsElectrical engineeringEngineeringImage (mathematics)Artificial intelligencePhysical chemistryMeteorologyComputer scienceAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesAluminum Alloy Microstructure Properties
Enhanced mechanical properties and high electrical conductivity of copper alloy via dual-nanoprecipitation | Litcius