Subsurface damage and bending strength analysis for ultra-thin and flexible silicon chips
Jian Wei, ZhaoXian Wang, Peng Jin, LongJi Zhu, Ying Chen, Xue Feng
Topics & Concepts
Materials scienceGrindingBendingComposite materialPolishingRotational speedEtching (microfabrication)Mechanical engineeringLayer (electronics)EngineeringAdvanced Surface Polishing TechniquesNanowire Synthesis and ApplicationsForce Microscopy Techniques and Applications