Evaluating and manipulating bonding strength at multilayer graphene-copper interface via plasma functionalization
Zhilei Dong, Shaoyu Zhao, Yingyan Zhang, Jie Yang, Ding‐Bang Xiong
Topics & Concepts
GrapheneMaterials scienceSurface modificationUltimate tensile strengthCopperWettingComposite materialPlasmaComposite numberBond strengthNanotechnologyLayer (electronics)MetallurgyChemical engineeringAdhesivePhysicsEngineeringQuantum mechanicsGraphene research and applicationsAluminum Alloys Composites PropertiesMXene and MAX Phase Materials